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PRODUCTS

PRODUCTS

Buried-blind via PCB
PRODUCT

Product Name: Communication equipment board


Specifications

Layer count:8

Board thickness:1.0mm

Base materials:FR4 S1000-2

Finished size:290*216mm

Surface finish:Lead-free tin

Line width/line space:3/3mil

Minimum hole:0.10mm

Solder resist color:Sensitive blue

Cu thickness:inner layer 1 OZ outer layer 1 OZ


Characteristic

Blind hole design, complex structure, two order HDI, blind hole L1-L2, L7-L8, buried hole L2-L3, L3-L6, L6-L7, through hole L1-L8

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